Universal GSM1 *upgraded* SMT Placement

Universal GSM1 *upgraded* ID: 6167

Universal GSM1 *upgraded* {ID: 6167}

Upgraded GSM uses the latest feeders. Extremely flexible and capable.
CEE ID: 6167
Status: Available
Model: GSM1 *upgraded*
Vendor: Universal
DOM: upgraded
Condition: Superior to inline with its age
Facilities: 230V, 3ph, 30 amps
Dims: 66x86 @ 7000 lbs

UPS+ - windows software
NPI Software - New Product Introduction s/w for quick set-up and minimal scrap
Updated VME! Vision ESI-650H card, EPC-16
42V and 24V feeder interface can accept latest and older UIC feeders
(4) interchangeable precision locking feeder banks
FlexJet with 2.6mil/pixel camera - Front mount
Flex Head (4 Spindle) - Rear mount
Magllean upward looking camera
*** PTF (matrix tray tower) Available ****
A GSM1 that has been completely updated by Universal.  
Windows UPS+ with NPI software,  
Updated feeder interfaces and banks.  
Magellan cameras and rebuilt VME.   
PTF with PTF conveyor included.   
The perfect solution for high flexibility, low cost, and up to date technology!  
NPI Software
Scrap-free first article build  
Provides the ability to verify the complete production process: board, feeders, fiducials, components, pre-placement x, y and theta data, and post-placement data  
FlexJet Head - The all-around performer
The FlexJet Head quickly and accurately places components as small as 0201 up to 55mm square and 25mm tall with single field-of-view inspection. Gang pick up to seven components.  C4/High force head - Unmatched flexibility and odd-form capability To handle your extreme application requirements, programmable insertion forces from 150 to 5000 grams. Additional features include selectable placement delay and normal, medium and slow tact modes.  
Magellan Digital Camera
Magellan’s advanced technologies and exceptional flexibility make it ideally suited to today’s demanding requirements, from new product development and introduction to high-volume, high-throughput applications.
• Large, 60mm field-of-view (FOV) minimizes multiple scans of large bumped/leaded devices
• Provides substantial throughput improvements for applications that typically require multiple FOVs
• High resolution of 1024 x 1024 to facilitate small part feature recognition
• Front, side, and on-axis lighting that can be used individually or in combination
• Lighting intensity is consistent across viewable area for faster, more accurate alignment and inspection
• Lighting calibration is performed on the machine, eliminating machine to- machine lighting intensity variation
Spec Placement Rate
● Max: 10,000 cph / 0.36 sec per component   
● IC +/-50microns @ 1.33 Cpk / +/-38microns @ 1.00 Cpk  
PCB Dimensions  
● Maximum Size: (WxLxH) 508 x 635 x 5.08mm (20 x 25 x 0.2")
● Minimum Size: (WxLxH) 50.8 x 50.8 x 0.508mm (2 x 2 x 0.02")
● Maximum Weight: 2.72kg (6lbs)
● Topside Clearance: 26.5mm (1.04")  
Component Range  
● Maximum Size: (WxLxH) 55 x 55 x 25mm (2.17 x 2.17 x 0.98") (150mm MFoV)
● Minimum Size: (WxLxH) 0.25 x 0.5 x 0.15mm (0.01 x 0.02 x 0.006")
● Maximum Weight: 35g (up to 130g via RFQ)
This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional for your live or video acceptance. If you require special acceptance criteria, please discuss this with your CEE sales agent. Availability is subject to prior sale.


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.




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