Universal GSM1 *upgraded* SMT Pick & Place

Universal GSM1 *upgraded* SMT Pick & Place {ID: 6167}

Status: Available
DOM: upgraded
Condition: Superior to inline with its age
Quantity: 1
Transfer Direction: Either

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Product installation requirements:

Facilities: 230V, 3ph, 30 amps
Dimms: 66x86 @ 7000 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area.  A CEE technician will demonstrate the unit fully functional for your live or video acceptance.  If you require special acceptance criteria, please discuss this with your CEE sales agent.  Availability is subject to prior sale.


Configuration

  • UPS+ 6.2.2.2 - windows software 
  • NPI Software - New Product Introduction s/w for quick set-up and minimal scrap 
  • Updated VME! Vision ESI-650H card, EPC-16 
  • 42V and 24V feeder interface can accept latest and older UIC feeders 
  • (4) interchangeable precision locking feeder banks 
  • FlexJet with 2.6mil/pixel camera - Front mount 
  • Flex Head (4 Spindle) - Rear mount
  • Magllean upward looking camera
  • *** PTF (matrix tray tower) Available ****

 

Description

A GSM1 that has been completely updated by Universal.  

  • Windows UPS+ with NPI software,  
  • Updated feeder interfaces and banks.  
  • Magellan cameras and rebuilt VME.   
  • PTF with PTF conveyor included.   
  • The perfect solution for high flexibility, low cost, and up to date technology!  

NPI Software

  • Scrap-free first article build  
  • Provides the ability to verify the complete production process: board, feeders, fiducials, components, pre-placement x, y and theta data, and post-placement data  

FlexJet Head - The all-around performer 
The FlexJet Head quickly and accurately places components as small as 0201 up to 55mm square and 25mm tall with single field-of-view inspection. Gang pick up to seven components.  C4/High force head - Unmatched flexibility and odd-form capability To handle your extreme application requirements, programmable insertion forces from 150 to 5000 grams. Additional features include selectable placement delay and normal, medium and slow tact modes

 

Specifications

Spec Placement Rate 

  • Max: 10,000 cph / 0.36 sec per component   

Accuracy  

  • IC +/-50microns @ 1.33 Cpk / +/-38microns @ 1.00 Cpk  

PCB Dimensions  

  • Maximum Size: (WxLxH) 508 x 635 x 5.08mm (20 x 25 x 0.2")

  • Minimum Size: (WxLxH) 50.8 x 50.8 x 0.508mm (2 x 2 x 0.02") 

  • Maximum Weight: 2.72kg (6lbs) 

  • Topside Clearance: 26.5mm (1.04")  

Component Range  

  • Maximum Size: (WxLxH) 55 x 55 x 25mm (2.17 x 2.17 x 0.98") (150mm MFoV) 

  • Minimum Size: (WxLxH) 0.25 x 0.5 x 0.15mm (0.01 x 0.02 x 0.006") 

  • Maximum Weight: 35g (up to 130g via RFQ)

Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.