Koh Young KY-3030 VAL 3D Solder Paste Inspection

Koh Young KY-3030 VAL 3D Solder Paste Inspection {ID: 6210}

Status: Available
DOM: 2008
Condition: Inline with its age
Quantity: 1
Transfer Direction: Either

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Product installation requirements:

Facilities: 220VAC, 1phase, 50/60Hz, 10Amp / Air: 0.4 - 0.5 Mpa
Dimms: 40 X 51 X 57 in. @ 1654 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


  • GUI Ver.3.5.2147P49 / 8/13/2012 6:50:34 PM
  • Vision Ver 1.2.1077P216 / 8/21/2012 12:39:32 AM
  • VisionTool 10.10.3 ,VPC 7.20 / 11/28/2011 9:02:54 AM
  • PCB Viewer 3.4.506 / 11/28/2011 9:02:52 AM
  • Remote Ver. 1.0.7
  • D_TOOL Ver.
  • GerberPad Ver.
  • SPC plus Ver. / 8/10/2012 12:51:26 PM


True 3D Volume Measurement
The true volume of solder pastes on PCBs using Koh Young's authentic 3D profilometry method. 

Basic Functions of KY-3030 Series
Paste defects detection including insufficient / excessive / missing paste, shape deformity, bridging and paste displacement

Highly Reliable and Accurate Inspection Systems

  • Volume repeatability : less than ±1% at 3σ (on a calibration target)
  • Volume repeatability on average: less than ±3% at 3σ (on a PCB)
  • Height accuracy: 2μm (on a calibration target)
  • GageR & R: much less than 10% at 6σ (± 50% tolerance) (for around 3,600 solder pastes on real PCBs from customer site)

No Shadow Effects and No Specular Problems
With Koh Young's proprietary technology, KY-3030 series overcome the common bottleneck of 3D measurement systems.

Fast Real-time 30 Inspection
Less than 5 sec on a real PCB with 4,000 pads(160 X 102mm)

Absolute Convenience
Less than 10 min. for inspection job file programming and conditions setup.

Special Features and Advantages

  • Extract Solder Paste Volume Only by Bare Board Teaching
  • Robust Inspection against PCB Warp up to ±5mm without any Z-axis motion
  • Effective Feedback Sensor to Operators
  • Remote Monitoring & Controlling Software
  • Sets of the SPC (Statistical Process Control) data for SMT Process Management


Metrology Capability
  Volume, Height, XY Position, Area
Defect Detection   lnsufficient / Excessive / Missing Paste, Bridging, Shape Deformity, Paste DispIacement
FOV (Field of View) Size   32 X 24 mm (1.26 x 0.94 in.)
XY Table Accuracy   10μm
Typical Load / Unload & Fiducial Find Time   4 sec
Height Accuracy   2μm
Repeatability  Height: ±1%   Volume: ±1%
Min. Paste Size   Rectangle: 150μm (5.9 mils)   Circle: 200μm (7.87 mils)
Max. Paste Height   400μm (15.7 mils)
Max. PCB Warp   ±5mm (0.19 in.)
Min. Distance between Solders   100μm (3.93 mils) (in case of 150μm solder paste height)

Statistical Analysis   Histogram, X Bar & R Chart, X Bar & S chart, Cp & Cpk, % Gage R&R Data,SPI Daily / Weekly / Monthly Reports
Inspection Position Teaching   Supports GERBER format (274 X 274D)
Vision Algorithm   3D / SFM (Shadow Free Moire Interferometry)
OS   Windows XP Professional
Probe Type   No Shadow Effect
Camera   2M B/W Digital Camera (1600 X 1200)
Dimensions ( W X D X H ) / Weight   1000 X 1290 X 1440 mn ( 40 X 51 X 57 in.) / 750 Kg (1,654lbs)
Max. PCB Size   VAL: 510 X 460mn(20 X 18 in.)

Type of Sample Board   Cellular Board(4 Arrays)
No. of Pads   3,848
Board Size(mm)   160 X102(6.3 X 4 in.)
High Speed Mode   5 sec
High Resolution Mode   6 sec
No Shadow Mode   8.2 sec

Type of Sample Board   Notebook Board
No. of Pads   3,845
Board Size(mm)  184 X 219 (7.2 X 8.6 in.)
High Speed Mode   12.1 sec
High Resolution Mode   14.6 sec
No Shadow Mode   19.9 sec

Type of Sample Board   Network Board
No. of Pads   7,006
Board Size(mm)   320 X 230 (12.6 X 9.1 in.)
High Speed Mode   25.3 sec
High Resolution Mode   30.1 sec
No Shadow Mode   41 sec


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.