Universal Genesis GC-60D SMT Pick & Place

Universal Genesis GC-60D SMT Pick & Place {ID: 6214}

Status: Sold
Condition: Superior to inline with its age
Quantity: 1
Usage : 68M /67M cycles
Transfer Direction: Either

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Product installation requirements:

Power: 200 - 240VAC, 3phase 60Hz
Air: 4.2 CFM @ 90psi (119 liters/min @ 6.2 bars)
Dimms: 66" x 89" x 75" @ 7867 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale


  • Model: 4990C
  • Dual Beam - 2 x Lightning Head
  • PSV
  • NPI
  • qty.2 Nozzle changers


The Genesis GC-60D provides an attractive cost per placement for small components, yet is equipped to manage the accuracy and repeatability demands of emerging technologies. This Platform is an ideal high speed chip machine with a component range far superior to traditional chipshooters.
The Genesis GC-60D is specifically designed to provide:
• Superior throughput
• High pick performance
• Fewer maintenance requirements
• Ease of use
• Broad component handling range, capable of handling 0402mm (01005) to 30mm (1.18”) square
Consistent with the original Platform concept, the Genesis GC-60D employs common mechanical, electrical, and software interfaces that allow Universal to develop options (heads, cameras, feeders, etc.) in response to changing
production demands.
Many options developed for original GSM Platforms are still compatible with the Genesis GC-60D. The Genesis GC-60D uses the exact length and locations for air and power connections to simplify migration and reduce installation expenses.


Machine Architecture
Machine Type: Gantry
Number of Gantries: 2
Drive System: Dual Linear Motor
X,Y Motor Type: VRM Linear
Operating system: Win 2000
Machine Capabilities
Machine Dimensions: Length x Depth (meters): 1.67 x 2.25
Board Handling
Max Board Size
     Inbound (L x W) (mm): 350 x 350
     Standard (L x W) (mm): 508 x 508
          Load Time(s) - Standard 3
     Optional (L x W) (mm) 635 x 610
          Load Time(s) - Optional 6
Topside Clearance (mm): 12.7 pass-through / 11 placement
Bottom side Clearance (mm):  27.7
8mm Input:  136
12mm Input:  68
16mm Input:  34
Tube Input:  No
Bulk Input:  No
Bank Change:  Yes
Splicing:  Yes
Component Capabilities
Min Component:  0402mm (01005”)
Max Component (square) - standard:  20mm (0.79”)
Max Component (square) - RFQ:  30mm (1.18”)
Max Component Height:  6mm (0.24”)
Min Component Pitch:  0.081mm(0.003”)
Min Ball Dia.:  102um
Placement Force(grams):  200 ± 20%
Special Vac Nozzle (Odd-form):  No
Gripper Nozzle (Odd-form):  No
Max CPH: 57,000
1608 CPH – Single Lane board Handling (IPC 9850 4 boards):  36,500
Practical Chip TACT (1608):  0.1125
Practical SOIC TACT (8 SOIC):  0.18
Practical Odd-form TACT:  N/A
1608 Accuracy:  65um @ 1.33 CpK
100QFP Accuracy:  65um @ 1.33 CpK
Supported Hardware
Head Type:   Lightning - 2 - Heads 30-Spindles each
Upward Looking Camera:  N/A
PTF:  No
Wafer Handler:  No
PrecisionPro Feeder Intfc/Bank Change:  Yes
Nozzle Changer Inventory:  140
Production Characteristics
Auto Nozzle Change during production:  During Changeover
Linear Sensor Equipped:  No
Repair Mode:  End of pattern
Vision lighting modes:  Front
Qty of Feeder duplicates for High-Running Component(Min.):  1
Closed-Loop Splice Validation:  Yes


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.