Pillarhouse Jade S-200 Selective Solder

Pillarhouse Jade S-200 Selective Solder {ID: 6244}

Status: Pending
DOM: 2007
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 208V – 250V 50/60Hz 4kVA
Dimms: 55" x 40" x 53"

Product Terms:

This unit is located in the CEE facility in the Chicago area.  A CEE technician will demonstrate the unit fully functional for your live or video acceptance.  If you require special acceptance criteria, please discuss this with your CEE sales agent.  Availability is subject to prior sale.


Configuration

• Universally Adjustable Tooling Carrier 
• Inerted Nitrogen System 
• Lead Free Capability (Titanium solder pot and pump assembly) 
• Solder Wire Feeder with Solder bath level sensor 
• Drop Jet Fluxer 
• Programming Camera 
• PillarCOM Windows Software 
• Internal Fume Extraction
• Integral PC with Machine Mounted Flat Screen Monitor 


Description

As part of the entry-level philosophy for this system, a low maintenance solder bath and pump mechanism has been developed which moves in three axes of movement whilst not limiting access to the PCB. Solder is applied using proven technology through our AP nozzle design or custom specialised nozzles, incorporating patented spiral solder return to bath technology offering reduced solder balling potential.
 
As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere. This method of soldering also assists in the prevention of oxidisation and provides a local preheat to the joint, thus reducing thermal shock to localised components.
 
The Jade MKII is controlled by a PC, through PillarCOMM, a Windows® based ‘Point & Click’ interface with PCB image display.  Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.


Specifications

Height: 1403mm / 55” – excluding light stack
Width: 1000mm / 40“
Depth: 1351mm / 53”
Board size: 457mm x 508mm / 18”x 20” (larger PCB size available upon request)
Edge clearance: Above / below 3mm
Height clearance: Above / below 40mm nominal
Above 190mm – special application
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 8kg
Applicators: AP style – 2.5mm to 16mm dia.
   Extended AP style – 2.5mm to 20mm dia.
   Micro nozzle – 1.5mm to 2.5mm
   Jet-Tip style – 6mm to 20mm dia.
   Jet-Wave nozzle – up to 25mm width
   Special dedicated nozzles available upon request
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water soluble system available
X, Y & Z Axis resolution: 0.1mm
Repeatability: +/- 0.05mm
Nitrogen usage: 35 litres gas/min. 5 bar pressure
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Power supplies: Single phase + PE
Voltage: 208V – 250V
Frequency: 50/60Hz
Power: 4kVA
Power with IR preheat: 6.5kVA – Top-side
   8kVA – Top with bottom-side ring heater
Transport: Hand load
Tooling: Integral adjustable board guides, includes finger extensions and board clamps
Programming: PillarCOMM Windows based ‘Point & Click’ interface

Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.