Universal Genesis GX-11D SMT Pick & Place

Universal Genesis GX-11D SMT Pick & Place {ID: 6268}

Status: Sold
DOM: 2006
Condition: Superior to inline with its age
Quantity: 1
Usage : 9M / 10M cycles
Transfer Direction: Either

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Product installation requirements:

Power: 200 - 240VAC, 3phase 60Hz
Air: 4.2 CFM @ 90psi (119 liters/min @ 6.2 bars)
Dimms: 66" x 89" x 75" @ 7867 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale


Configuration

  • Model: 4988E
  • Dual Beam - 1 FlexJet 3 & 1 InLine4 Head
  • Magellan Upward Looking Camera - 2.3mpp
  • PSV
  • NPI
  • Nozzle changers for each head

Description

The Genesis provides an attractive cost per placement for small components, yet is equipped to manage the accuracy and repeatability demands of emerging technologies.  The Genesis GX-11D has been developed to be an advanced flexible placement platform with a FlexJet 3 head on the front beam and a 4-spindle, InLine4 HF head on the rear beam. Also included is an upward looking camera in the rear of the machine, a 70-pocket nozzle changer in the front, and a large bore 7-pocket nozzle changer in the rear.

the Genesis Genesis GX-11D is a versatile IC placement platform perfect for special processes such as Pin-In-Paste, Flip Chip and Odd Form

The Genesis GX-11D is specifically designed to provide:

  • Superior throughput
  • High pick performance
  • Fewer maintenance requirements
  • Ease of use
  • Broad component handling range, 0603mm (0201”) to 55mm (2.165”) square

Consistent with the original platform concept, the Genesis GX-11D employs common mechanical, electrical, and software interfaces that allow Universal to develop options (heads,
cameras, feeders, etc.) in response to changing production demands. 

Many options developed for original GSM Platforms are still compatible with the Genesis GX-11D. The Genesis uses the exact machine length and locations for air and power connections to simplify migration and reduce installation expenses.

The GX-11D Features:

  • Dual-beam, dual-drive overhead gantry system
  • Patented VRM linear motor positioning system
  • Mixed-head / dual-head configuration
  • Upward looking camera optics
  • Spec speed: 0.21 sec (17,400 cph)
  • Accuracy: +/-40μm @ 1.33 Cpk
  • Range: 1005mm (0402) - 55mm x 55mm SFoV
  • Max PCB Size: W610mm x L813mm (24" x 32")
  • Feeder inputs: 120 - 132 (dual-lane 8mm tape)
  • Feeder types: wafer, waffle pak, gel pak, tape,tube, bowl

Specifications

Spec Placement Rate Max:   17,400 cph / 0.21 sec per component

  • 4-Board IPC IC (100 QFP):   5,100 cph / 0.71 sec per component

Accuracy IC:   ±40μm @ 1.33 Cpk / ±30μm @ 1.00 Cpk

PCB Dimensions
     Maximum Size:
  (WxLxH) 508 x 635 x 5.08mm (20 x 25 x 0.2")
     Minimum Size (WxLxH):   50.8 x 50.8 x 0.508mm (2 x 2 x 0.02")
     Maximum Weight:   2.72kg (6 lbs)
     Topside Clearance:   26.5mm (1.04")
     with big board kit:   Maximum Size (WxLxH) 610 x 813 x 5.08mm (24 x 32 x 0.2")

Component Range
     Maximum Size:   (WxLxH) 55 x 55 x 25mm1 (2.17 x 2.17 x 0.98")
     Minimum Size:   (WxLxH) 0.25 x 0.5 x 0.15mm (0.01 x 0.02 x 0.006")
     Maximum Weight:   35g (up to 130g via RFQ)

Machine Dimensions:   (LxDxH) 1676 x 2248 x 1930mm (66 x 88.5 x 75.9")
Machine Weight:   3500kg (7700lbs)


Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.