This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance. Availability is subject to prior sale.
- BGA 3101: Control Box
- BGA 3591:Main system
- CPU, monitor, keyboard, mouse, etc.
- Nozzles and spares
Metcal BGA/CSP Rework Systems
The rework of an array package requires process control and repeatability, to replicate the original assembly thermal process. When reworking BGA, a greater level of process control is required to reduce the risk of a defect and to ensure the perfect result: right first time.
To enhance performance, the Metcal BGA and CSP Rework Systems have incorporated new features that facilitate easier use and improve process control.
- Improved ergonomics and simplified controls make using the system easy and natural for the operator.
- Improved vision clarity provides better control of component placement.
- Larger pre-heater provides increased power for thermally demanding boards.
Metcal Vision System
The BGA-3590 and CSP-3500 both offer an integral vision system for accurate component and stencil alignment. The vision system utilizes a prism that allows the user to look simultaneously at the topside of the printed circuit board (PCB), and a superimposed image of the underside of the component.
Using micrometer adjustment, the images can be accurately aligned in the X, Y & Theta axis, prior to placement. The BGA 3590 incorporates a corner overlay mechanism to facilitate alignment on large components, while the CSP 3500 offers higher magnification and greater clarity for smaller components with reduced ball pitches.
The vision systems include facilities for either solder paste or flux application to the rework area — without the need to remove the board from the machine. Consistent solder paste deposits can be printed using the vision-mounted stencils that allow accurate alignment and co-planarity adjustment.
As with production reflow oven technology, both Metcal Rework Systems use low airflow forced convection heating. The Patented Micro Oven reflow head delivers temperature uniformity, assuring safe and simultaneous reflow of the component being removed — without disruption to adjacent parts. The systems are fitted with an under-board heater. The CSP version has a 1000W convection heater suitable for smaller PCBs, while the BGA version is fitted with a 1400W large area heater with the capacity to work with
thermally demanding multi-layer boards. This eliminates problems associated with warped boards.
Windows Based Software
This interactive software precisely controls both heaters, making profile set up simple. Using closed loop feedback monitoring, the user-friendly software controls the four stages of the reflow profile: Preheat, Soak, Reflow and Cooling.
The board temperature can be monitored using the integrated flying thermocouple, and real time adjustments can be made to the times and temperatures — while the profile is running.
Metcal Soldering System
To assist with pad cleaning and preparation, all units are supplied with a Metcal MX Direct Power Soldering System that reduces the risk of track and pad damage caused by overheating.
Input voltage: 115v AC, 50/60Hz
> Base unit: 1400W
>Control box: 420W max
Reflow head heater element: All voltages: 28v AC 280W max
Temperature control: Closed-loop K-type thermocouple feedback
Maximum source temperature
- Under-board heater: 200°C (572°F)
- BGA reflow head: 400°C (752°F)
Airflow: 3-20 l/min
Component maximum weight: 55g (.92 oz.)
Maximum PCB dimensionsL 17" (432mm) x open frame
PCB thickness: 0.8 to 3.2mm
Vision system magnification range: 10 to 50X
Maximum field of vision at lowest magnification: 46 x 46mm
Mirror type: Split field mirror
- Base unit: 22" x 24" x 19" (560 x 610 x 485mm)
- Control box: 13" x 6" x 9.5" (330 x 153 x 241mm)
- Base unit: 76.5 lbs. (34.7 kg)
- Control box 20 lb. 7 oz. (9.27kg)