DOM: Sept 2012
Condition: Superior to inline with its age
Usage : 4.6M / 2.0M cycles
Transfer Direction: Either
Product installation requirements:
Power: 200 - 240VAC, 3phase 60Hz
Air: 4.2 CFM @ 90psi (119 liters/min @ 6.2 bars)
Dimms: 66" x 89" x 75" @ 7867 lbs
This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance. Availability is subject to prior sale
A 7-spindle InLine7 head (without on-the-head camera) on the front of the beam and a 4-spindle inLine4 HF head on the rear of the beam pick components from various fixed feeder locations. The components are vision inspected and then placed on a stationary PCB. Also included is an upward looking camera in the front and rear of the machine, a 70-pocket nozzle changer in the front, and two large bore 7-pocket nozzle changers in the front and rear.
the Genesis Genesis GX-11S is a versatile IC placement platform perfect for special processes such as Pin-In-Paste, Flip Chip and Odd Form
The Genesis GX-11S is specifically designed to provide:
Consistent with the original platform concept, the Genesis GX-11S employs common mechanical, electrical, and software interfaces that allow Universal to develop options (heads,
cameras, feeders, etc.) in response to changing production demands.
Many options developed for original GSM Platforms are still compatible with the Genesis GX-11S. The Genesis uses the exact machine length and locations for air and power connections to simplify migration and reduce installation expenses.
The GX-11S Features:
InLine7 Placement Head
An InLine7 placement head with an upward-looking camera is also available to expand the component range capabilities. The InLine7 quickly and accurately places components up to 55mm square with single a field-of-view, and allows for gang-picking of up to seven components.
InLine4 HF Placement Head
The InLine4 HF version of the 4-spindle flexible pick and place head is ideal for special applications on the Genesis Platform. The higher placement force range of 150 to 5000g accommodates placement of flip chip, and odd-form components (axial, radial, headers, connectors, snap-in- devices, etc.), pin-in-paste applications, as well as the full range of standard surface mount devices.
On the InLine4 HF head, 4 spindles are arranged in 40 mm spacing for full gang picking from 8, 12, 16, 24, and 32mm feeders. Each spindle accepts a wide variety of placement nozzles including grippers to accommodate the broadest range of components and applications. Vision inspection requires an upward-looking-camera station.
Spec Placement Rate Max: 15,300 cph
Accuracy IC: ±40μm @ 1.33 Cpk / ±30μm @ 1.00 Cpk
Maximum Size: (WxLxH) 508 x 635 x 5.08mm (20 x 25 x 0.2")
Minimum Size (WxLxH): 50.8 x 50.8 x 0.508mm (2 x 2 x 0.02")
Maximum Weight: 2.72kg (6 lbs)
Topside Clearance: 26.5mm (1.04")
with big board kit: Maximum Size (WxLxH) 610 x 813 x 5.08mm (24 x 32 x 0.2")
Maximum Size: (WxLxH) 55 x 55 x 25mm1 (2.17 x 2.17 x 0.98")
Minimum Size: (WxLxH) 0.25 x 0.5 x 0.15mm (0.01 x 0.02 x 0.006")
Maximum Weight: 35g (up to 130g via RFQ)
Machine Dimensions: (LxDxH) 1676 x 2248 x 1930mm (66 x 88.5 x 75.9")
Machine Weight: 7150 lbs
Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.