YXLON Cheetah SMT X-Ray

YXLON Cheetah SMT X-Ray {ID: 6385}

Status: Sold
DOM: 08/11
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: pending
Dims L/W/H: 1,650 / 1,400 / 2,050mm (65" x 57" x 81") @ ~ 2,200 kg (4,850 lbs)

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Complete X·ray Protection Cabinet With Safety Interlocks
160 Kv Microfocus Demountable Open X-ray Tube

  • Transmission Target (-500 Nanometer Resolution}
  • True X-ray Intensity (Txi) Control
  • 10 Watts Target Power

Qty.6 -  Motor Driven Axes Manipulation System With Software Controls
Qty.3 -  Axes Sample Manipulation, 1-Axes Tube Manipulator, 2-Axis Detector Manipulator

  • 140+ Degree Oblique Viewing via Detector Tilt
  • High Resolution DDD Image Chain
  • CNC Capabilities
  • Optical Camera for Sample Positioning

Feinfocus Graphical User Interface (FGUI) Including:

  • Windows Operating System
  • Integrated X·ray Controller
  • 16-BIT FIP-600 Real Time Image Processing System
  • Ethernet Connection and CD Read Write Drive

Extended FGUI Includes:

  • Bga Analysis, Die Attach Analysis and AVI Recorder

Amorphous Si 1024² Pixel Digital Detector
Ergonomic Workstation With 24" 16:9 Flat Screen Display Monitor, Keyboard, Joysticks and Mouse
Line Matching Transformer
Rotational Sample Table (N X 360 Motorized Rotation)

CE Marked


The Cheetah EVO range of X-ray inspection solutions was created to achieve a simple goal: the very best image in the shortest time. The result is sheer visual brilliance. Cheetah EVO systems harness the combined power of several YXLON innovations – FeinFocus X-ray tube technology; high-power target technology; a finely calibrated, long-life flat-panel detector and a state of the art manipulation system. The systems can generate images in extremely high resolution, easily overcoming the unique challenges of the SMT application areas.

In addition to imaging excellence, with Cheetah EVO you can look forward to simple, user-friendly controls and intuitive FGUI – Feinfocus Graphical User Interface – software. Not to mention the myriad of benefits of comprehensive automation. One-click solutions make manual inspection effortless and live SMART filters ensure perfect images.

Easy Teach-In makes it simple to program complex automated routines that guide you swiftly through inspection steps and deliver repeatable,reliable results and automated reports.

Key benefits for SMT

  • Accurate, fast and repeatable inspection – manually and automatically
  • High power, high resolution inspection of very small features
  • Easy to use, dynamic image enhancing filters e.g. eHDR

Electronic components are becoming increasingly miniaturized. High-resolution and high-magnification YXLON industrial X-ray and computed tomography (CT) inspection systems provide the necessary tools for the examination of such components.

Typical surface-mounted device (SMD) inspection tasks include:

  • Testing of bond wires and bonding areas
  • Cavity analysis conductive and non-conductive chip bonding compounds
  • Testing of 3D integrated circuits (IC) solder joints (micro bumps, copper pillars, Through-Silicon Vias (TSV)) in processor packages
  • Analysis of discrete components such as capacitors and coils

It is important to find cracks, open solder joints or voids via X-ray inspection. Additionally the measurement of pore sizes and their distribution is critical. Many of these inspections are performed automatically for an improvement in the production process.

Our YXLON industrial CT inspection systems provide the highest resolution 3D non-destructive failure analysis of semiconductor devices.


Model:   Y Cheetah AH

Serial Tag

  • Max KVA:   160 / 1.0 mA
  • Lead Equivalence (mmPb)
    • Front:   4.5
    • Right Side:   4.5
    • Top:   3  4.0
    • Rear:   5.4
    • Left Side:   4.5
    • Bottom:   2.4

General Product Features

  • Time to first image (typ.) ~ 10 s
  • Reconfiguration time (typ.) < 60 s
  • µCT scan time ~ 7 s
  • µCT reconstruction time ~ 60 s
  • micro3Ds scan time ~ 20 s
  • micro3Ds reconstruction time ~ 20 s
  • Access for sample loading large automated door (690 x 650 mm)
  • System window 520 x 370 mm
  • Monitor New 27” Ultrasharp, wide viewing angles
  • Zoom+ yes
  • PowerDrive yes
  • Image stabilization air suspension


  • Manipulation control via mouse or joystick
  • Inspection area (max.) 460 mm x 410 mm (18”x 16”)
  • Sample size (max.) 800 mm x 500 mm (31”x 19”)
  • Sample tray axes X,Y, rotation
  • Oblique viewing +/-70° (140°)

X-Ray Tube

  • Tube type open X-ray tube
  • Target transmissive
  • Voltage range 25–160 kV
  • Current range 0.01–1.0 mA
  • Max. tube power 64 W
  • Max. target power 15 W
  • Detail detectability < 1 µm
  • X-ray intensity control TXI

Image Chain

  • Geometric magnification (max.) ~ 3,000x
  • Total magnification (max.) ~ 384,000x

Physical Dimensions

  • Width / depth / height 1,650 / 1,400 / 2,050 mm (65" x 57" x 81")
  • Weight ~ 2,200 kg (4,850 lbs)


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.