YESTech YTX-X3 3D X-Ray

YESTech YTX-X3 3D X-Ray {ID: 7430}

Status: Available
DOM: 2013
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 110 VAC 1ph, 50/60Hz, 15amps / 80 psi, 2 CFM
Dims: 59" x 66" x 63" @ 5,500 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Configuration

  • New tube installed in 2018

  • includes Manuals and Spares

Description

Nordson YESTECH's versatile X3 Automated X-Ray Inspection System (AXI) offers complete inspection of solder joints and other critical hidden features found in electronic assemblies, PCB's and packaged semiconductors.

Ideal for in-line or off-line operation, the X3's innovative algorithms enable fast and reliable automated inspection and real-time monitoring of critical process information. Programming is fast and intuitive. Nordson YESTECH's state of the art, patented Digital Tomosynthesis Technology acquires multiple images in different slice heights in one inspection cycle. The images can discriminate between components on the top and bottom slices of double sided boards for unimpeded automated inspection.

The utilization of standard package libraries simplify training and ensure program portability across manufacturing lines. Newly available image processing technology integrates several techniques and inspection algorithms, to provide complete inspection coverage with an extremely low false failure rate. When integrated with Nordson YESTECH AOI inspection, these systems can increase fault coverage to include nearly all process defects.

Features:

  • Automated 2D & 3D inspection
  • Unsurpassed image quality
  • High defect detection
  • Low false calls
  • Fast throughput
  • Quick set-up Automated Inspection for:
    • Opens & shorts
    • Insufficient / excess solder
    • Lifted leads & tombstoned parts
    • BGA R Voids
    • Component presence and position

Specifications

Inspection Capabilities
Modes:   2D and 3D operation
Throughput:   4 to .5 sq. in./sec
Maximum Board Size:   Up to 20B x 18B (508mm x 450mm)
Clearance:   Up to 2B (50mm) top and 1B (25mm) bottom
Minimum Component Size:   01005
Defects Detected:  
     Part:   position, missing, wrong, skew, tombstone
     Lead:   bent, lifted, bridging
     Solder:  open, insufficient, short, solder balls
     BGA:   shorts, voids, position, missing ball

Software
Data Requirements:   ASCII Text, NDF pin data
CAD Translation Package:   Excel, Aegis, Unicam, NDF translator, YT translator
Programming Skill Level:   Technician or operator
Operating System:   Windows XP Professional
Off-line Software:   Optional - Rework, Review and Program Creation
SPC Software:   Optional - Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.

Hardware
X-Ray Tube:

  •  Maintenance free, sealed reflection target, 5 micron spot size
  •  100 or 130 Kv, 20 to 39-watt max. output

Color Camera:   Barcodes and Fids

Facilities
Power:   110 VAC (220 optional) Single Phase 50 / 60 Hz 15amps
Footprint:   59" x 66" x 63" (1,500mm x 1,676mm x 1,600mm)
Weight:   5,500 lbs. (2,495 Kg)
Machine installation:   < 1 hour
Compressed Air:   80 psi, 2 CFM


Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.