Universal Genesis GC-30S SMT Pick & Place

Universal Genesis GC-30S SMT Pick & Place {ID: 7484}

Status: Available
DOM: 2008
Condition: Superior to inline with its age
Quantity: 1
Usage : 47M cycles
Transfer Direction: Either

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Product installation requirements:

Facilities: 200 - 240VAC, 3phase 60Hz
Dimms: 66" x 89" x 75" @ 7200lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale


  • Model: 4993B (PC based VME.)
  • Single Beam - Lightning Head
  • NPI
  • qty.2 Nozzle changers


The Genesis GC-30S is Universal’s newest single beam Platform. It provides an attractive cost per placement for small components, yet is equipped to manage the accuracy and repeatability demands of emerging technologies. This Platform is an ideal high speed chip machine with a component range far superior to traditional chipshooters.

The Genesis GC-30S is specifically designed to provide:

  • Superior throughput
  • High pick performance
  • Fewer maintenance requirements
  • Ease of use
  • Broad component handling range, capable of handling 0402mm (01005) to 30mm (1.18”) square

Consistent with the original Platform concept, the Genesis GC-30S employs common mechanical, electrical, and

software interfaces that allow Universal to develop options (heads, cameras, feeders, etc.) in response to changing production demands.

Many options developed for original GSM Platforms are still compatible with the Genesis GC-30S. The Genesis GC-30S uses the exact length and locations for air and power connections to simplify migration and reduce installation expenses.


Machine Configuration Genesis GC-30S

Machine Architecture

Machine Type: Gantry

Number of Gantries: 1

Drive System: Dual Linear Motor

X,Y Motor Type: VRM Linear

Operating system: Win 2000


Machine Capabilities

Machine Dimensions

     Length x Depth (meters): 1.67 x 2.25


Board Handling

Max Board Size

     Inbound (L x W) (mm): 350 x 350

     Standard (L x W) (mm): 508 x 508

          Load Time(s) - Standard 3

     Optional (L x W) (mm) 635 x 610

          Load Time(s) - Optional 6

Topside Clearance (mm): 12.7 pass-through / 11 placement

Bottom side Clearance (mm):  27.7



8mm Input:  136

12mm Input:  68

16mm Input:  34

Tube Input:  No

Bulk Input:  No

Bank Change:  Yes

Splicing:  Yes


Component Capabilities

Min Component:  0402mm (01005”)

Max Component (square) - standard:  20mm (0.79”)

Max Component (square) - RFQ:  30mm (1.18”)

Max Component Height:  6mm (0.24”)

Min Component Pitch:  0.081mm(0.003”)

Min Ball Dia.:  102um

Placement Force(grams):  200 ± 20%

Special Vac Nozzle (Odd-form):  No

Gripper Nozzle (Odd-form):  No


Max CPH: 32,000

CPH/m^2:  8,516

1608 CPH – Single Lane board Handling (IPC 9850 4 boards):  19,750

Practical Chip TACT (1608):  0.182

Practical SOIC TACT (8 SOIC):  0.26

Practical Odd-form TACT:  N/A



1608 Accuracy:  65um @ 1.33 CpK

100QFP Accuracy:  65um @ 1.33 CpK


Supported Hardware

Head Type Lightning - 1-Head 30-Spindles

Upward Looking Camera:  N/A

PTF:  No



Wafer Handler:  No

PrecisionPro Feeder Intfc/Bank Change:  Yes

Nozzle Changer Inventory:  140


Production Characteristics

Auto Nozzle Change during production:  During Changeover

Linear Sensor Equipped:  No

Repair Mode:  End of pattern

Vision lighting modes:  Front

Qty of Feeder duplicates for High-Running Component(Min.):  1

Closed-Loop Splice Validation:  Yes


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.