Universal GDM Dispenser

Universal GDM Dispenser {ID: 7502}

Status: Available
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 230V, 3ph, 30 amps
Dims: 66x86 @ 7000 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Configuration

  • UPS+ 6.2.2.2 - windows software
  • NPI Software - New Product Introduction s/w for quick set-up and minimal scrap
  • Updated VME! Vision ESI-650H card, EPC-16
  • 42V and 24V feeder interface can accept latest and older UIC feeders
  • PDP Dispense Head
    Note: A placement had can be added for pick, place, and dispense operations.


Description

Note: The GSM platform is highly configurable. CEE can add placement capability to this machine for dispense and pick & place operation.

A GSM1 that has been completely updated by Universal.  

  • Windows UPS+ with NPI software,  
  • Updated feeder interfaces and banks.  
  • rebuilt VME.   

NPI Software

  • Scrap-free first article build  
  • Provides the ability to verify the complete production process: board, feeders, fiducials, components, pre-placement x, y and theta data, and post-placement data  

Positive Displacement Pump

The single dispense head uses four independently controlled pumps, each fed by its own syringe to accurately dispense material onto the board. Positive displacement pumps ensure high quality, repeatable dots in a variety of ambient conditions. A standard nozzle selection dispenses for 0603 to 50mm square ICs.

To change dot volume, adjust the length of the pump stroke, increase the number of pump strokes per site, or use an alternate nozzle selection. Pumps and syringe holder assemblies are quickly removed for easy maintenance, at a programmable location. Dispensing head processing requires a board support to maintain the integrity of the adhesive dot.

• A compliant Z axis and board support combine to minimize the effects of board warpage, sag, and/or flex during dispensing.

• Low Material Sense warns the operator of a low material level while still dispensing a preprogrammed number of dots onto the board.


Specifications

Dispense Specifications

Cartridges  10cc and 30cc, customer supplied 

Dispense Rate   Applcation Dependent (max 40,000 dph)

Intrinsic Availability   98%

X, Y Accuracy   0.020mm (±0.0008")

X, Y Repeatability (σ)   0.018mm (<0.0007")

Diameter Repeatability (σ)   0.013mm (<0.0005")

 

PCB Dimensions  

Maximum Size: (WxLxH) 508 x 635 x 5.08mm (20 x 25 x 0.2")

Minimum Size: (WxLxH) 50.8 x 50.8 x 0.508mm (2 x 2 x 0.02")

Maximum Weight: 2.72kg (6lbs)

Topside Clearance: 26.5mm (1.04")  


Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.