YESTech YTV-F1 AOI

YESTech YTV-F1 AOI {ID: 7614}

Status: Available
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 110VAC 50/60Hz, 15A & 30 PSI min.
Dims: 55” x 57” x 50” @ 2,000 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Description

AUTOMATED INSPECTION FOR:

  • Solder defects
  • Lead defects
  • Component presence and position
  • Correct part / polarity
  • Through-hole parts
  • Paste

YTV F1 Series AOI A u t o m a t e d   P C B   I n s p e c t i o n

  • Quick Set-up
  • High Speed
  • High Defect Coverage
  • Low False Failure Rate
  • Best Price Performance
YESTech’s advanced Thin Camera technology offers high-speed PCB inspection with exceptional defect coverage. With up to two top-down viewing cameras and four side viewing cameras, the F1-Series inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.
 
Programming the F1-Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The F1-Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.  Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
 
Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-reflow or final assembly inspection.  Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.

Specifications

Inspection Capabilities

Throughput: Up to 5 sq. in./ sec. > 250,000 components per hour

Maximum Board Size: 22” x 20” (560mm x 510mm)

Clearance: 2” (50mm) top and bottom

Minimum Component Size: 0201; 01005 with high magnification option

Defects Detected:

     Component: position, missing, wrong, polarity, skew, tombstone

     Lead: bent, lifted, bridging

     Solder: open, insufficient, short, solder balls

 

Software

Algorithms: Normalized correlation, OCV, OCR, barcode recognition and rule-based

CAD Input: Pick and place data, CAD x-y data

CAD Translation Package: Excel, Circuitcam, Unicam, CIMBridge, Fabmaster

Programming Skill Level: Technician or operator

Operating System: Windows XP Professional

Off-line Software: Optional software for rework and off-line programming

Outputs: Real-time SPC outputs reporting first pass yield, defect by classification,reference designator and part number with remote monitoring.

 

Hardware

Material Handling: USB 2, SMEMA, dual direction auto width conveyor

Lighting: LED top light, proprietary bi-color multiangle LED lighting

Imager: Multiple Thin Camera™ mega-pixel color cameras

Resolution 1280 x 1024; 25 micron pixel size

Board Clamps: Optional

High Magnification: Optional 12 micron high magnification camera

Bottom Side Camera: Optional for bottom side bar codes

 

Facilities

Power: 110VAC ( 220 optional ) 50/60 Hz, 15 amps

Air input: 30 PSI min., 1/4 air hose

Footprint: 55” x 57” x 50” (1400mm x 1450mm x 1270mm)

Weight: 2,000 lbs (907 kg)

Machine Installation: < 1 hour


Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.