Universal AdVantis AC-30L SMT Placement

Universal AdVantis AC-30L SMT Placement {ID: 7616}

Status: Available
DOM: 2004
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 200-240VAC, 3ph & 3CFM @ 90psi
Dims: 66" x 66.5" x 87.1" @ 5,700lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Model: 4983A
  • Lightning Head - 32,000 cph from a compact footprint
  • 72 Feeder slots (144 with dual lane feeders)
  • UPS+ windows s/w with upgraded VME (version 6.6)
  • Board support
  • 24/42V feeder interface
  • NPI (new product introduction) software
  • Precision Pro Feeder banks - removable (qty.4)


The AdVantis AC-30L is a high speed modular mounter, specifically engineered for application flexibility and long term reliability. The AdVantis AC-30L provides an attractive cost per placement for small components, yet is equipped to manage the accuracy and repeatability demands of emerging technologies. This Platform is an ideal high speed machine with a component range far superior to traditional chipshooters.
The AdVantis AC-30L is specifically designed to provide:
  • Superior throughput
  • High pick performance
  • Fewer maintenance requirements
  • Ease of use
  • Broad component handling range, 0603mm (0201) to 30mm (1.18”) square
New Product Introduction Software (NPI)
The NPI software package provides the following benefits to not only New Product Introduction and First Article build, but to everyday production issues no matter what the manufacturing environment.

Features included within this software are as follows:

  • Feeder Inspection
  • Fiducial Inspection
  • Pre-placement Inspection
  • Circuit / Offset Inspection
  • Board Population
  • Post-placement Inspection


Component Handling Capabilities for Lightning Head

  • Component Width:  (min) 0.3mm (0.012”) - (max) 30mm3 (1.181”)
  • Component Length: (min) 0.6mm (0.024”) - (max) 30mm3 (1.181”)
  • Component Height: (min) 0.15mm (0.006”) - (max) 6mm (0.24”)2
  • Component Weight: 4 grams
  • Placement Force (grams): 200 ± 20%
  • MELF Diameter: (min) 3.5mm (0.14”)
  • Lead Pitch (wide camera): (min) 0.3mm (0.012”)
  • Lead Pitch (narrow camera): (min) 0.1mm (0.004”)
  • Minimum Lead Width (30 mm Square Component Size): 0.46mm (0.018”)
  • Minimum Lead Width (20 mm Square Component Size): 0.36mm (0.014”)
  • Bump Diameter (narrow camera): 0.102mm (0.004”)


Final Placement Performance 50 DPM

Intrinsic Availability 98%

Maintenance Interval 5.7 Hours every 6 weeks

Placement Capability – Universal Reference Method with Glass Slugs on Glass Plates

  • X/Y Spec Limits(um): 65
  • Theta Spec Limits (deg): 1.0
  • Min Cpk: 1.33

Machine Speed

  • Maximum CPH: 33,600 using 1005(0402)
  • 4 board IPC: 21,000 using 1608 (0603)

Board Specifications

  • Length: Min[50.8mm (2”)] Max[508mm (20”)]
  • Width: Min[50.8mm (2”)] Max[457mm (18”)]
  • Thickness: Min[0.508mm (.02”)] Max[5.08mm (.2”)]
  • Weight: 2.72kg (6lbs)

Board Clearance

  • Topside Clearance: 25.4mm (1.00”)
  • Bottom Side Clearance: 25.4mm (1.00”)


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.