Manncorp 28D.400 Compact Wave Solder

Manncorp 28D.400 Compact Wave Solder {ID: 7617}

Status: Available
DOM: 06.2018
Condition: Inline with its age
Quantity: 1
Usage : low
Transfer Direction: Left to Right
Max PCB Width: 16"
Length : 138"

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Product installation requirements:

Facilities: 220V, 3ph   / Air: 60psi
Dims: 128"L x 55"W x 63"H @ 2535lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


  • lead free by design
  • titanium fingers and pot
  • Dual nozzle solder pot
  • auto spray fluxer
  • 4.2' of convection preheat
  • motorized width control
  • motorized pot
  • automatic feeder cleaner
  • Was running SAC305.  Pot empty.


Designed for budget conscious assemblers with intermediate to heavy throughput requirements, Model 28D.400 wave solder machine comes standard with a number of advanced features. The wave solder system features an auto-cleaning titanium finger conveyor with motorized width adjustment that handles PCBs up to 15.75" (400 mm) wide. The internal, automatic spray fluxing system includes a precision, low-pressure atomizer. The highly stable, 4.2' (1300 mm) convection preheater activates fluxes while prepping the assembly for soldering temperatures. The 28D.400 wave solder machine also includes a high-capacity 370 kg (816 lbs. approximate weight for lead free solder), lead-free-ready titanium-alloy solder pot and color LCD touch-panel control, with all parts backed by a one-year warranty.


28D.400 is configured with dual waves to accommodate through-hole, surface mount and mixed-technology assemblies. The chip wave can be deactivated through the user interface for non-SMT applications, although the addition of the oscillating wave option will allow the chip wave to aid in hole fill and bridge reduction for difficult-to-solder boards of all technologies.

The standard maximum wave width of 410 mm (16") can be adjusted, relative to PCB dimensions, through the use of an optional wave reducer mechanism and helps to minimize dross formation. Board interval sensing for wave activation and an energy-saving standby mode also aid in dross reduction.

The solder module is driven by two heavy-duty, transducer-controlled 1/4 HP motors to ensure precise, uniform wave heights.

One titanium-alloy lead-free-ready solder pot with a 370 kg (816 lbs Approximate weight for lead free solder) capacity comes standard with the 28D.400. The solder pot is mounted to a heavy-duty, roll-out carriage assembly that allows for easy access and maintenance. For assemblers that have not entirely phased out lead-based solders, a second pot with a quick-connect socket can be added for easy conversion between lead-based and lead-free solders.


The 28D.400 includes an automatic internal spray fluxing system in which a precision spray nozzle assembly is mounted to a reciprocating Y-axis drive mechanism to ensure even and accurate application of flux.

The system adjusts automatically to accommodate the PCB size and utilizes a high-precision, low-pressure atomizer to provide excellent coating and through-hole penetration.


After flux application, boards enter a two-zone high-capacity forced hot air convection preheat with independent zone temperature controls to allow precise thermal profiling for proper flux activation and optimal solder wetting as assemblies enter the wave module.

If additional profiling control is needed, or for assemblies sensitive to top and bottom side temperature differential, a top-side preheater can be added at minimal cost.


Motorized conveyor width adjustment, from 50-400 mm (2"-15.75"), is standard on all 28D.400 wave soldering equipment, dramatically reducing setup time and eliminating operator inconsistency.

An aluminum-alloy pin-type conveyor input mechanism feeds the dual-titanium-finger conveyor, which includes a built-in finger cleaner, closed-loop speed control and overload protection.

Conveyor angle is adjustable from 4° - 7° and nominal speed setting is variable from 0.5-2.2 m/min (20"-87"/min) for maximized throughput.



  • conveyor speed     0.5 - 2.2 m/min (20" - 87"/min)

  • conveyor width     50 - 400mm (2" - 15.75"

  • PCB size (Max.)     400mm x 400mm (15.75" x 15.75")


  • preheat method     forced hot air convection

  • preheat length     51" (two 650mm segments)

Solder Pot / Wave

  • solder pot     lead free

  • solder pot capacity     ~816lbs (370kg) lead-free   /   ~926lbs (420kg) SnPb

  • solder pot temperature range     ambient to 300°C (572° F)

  • solder pot start-up time     ~60 minutes

  • wave height     0.4" (10mm)

  • maximum lead protrusion     0.39" (10mm)

  • wave width     16" (410mm)

General Specifications

  • control system     touch screen

  • power consumption     24KW

  • main power source     200V / 3ph / 50-60Hz

  • air pressure requirement     4kfg/cm² / 0.4MPa / 60psi

  • exhaust fan     400W 1ph 220V

  • solder furnace motor     0.18kw x 2, 3ph, 220V

  • drive motor     60W x 1ph 220V

  • solder furnace heating wire     2KW x 6 1ph 220V

  • preheater heating pipe     0.8KW x 18 1ph 220V

  • pawl cleaning pump     12W

  • forced cooling fan     48W

  • machine dimenstions     138"L x 55"W x 63"H (3500mm x 1390mm x 1600mm), includes conveyor

  • new weight     2535 lbs (1150kg)


Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.