YesTech B3 AOI (Table Top)

YesTech B3 AOI (Table Top): click to enlarge

YesTech B3 AOI (Table Top) {ID: 7626}

Status: Available
Condition: Inline with its age
Quantity: 1

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Product installation requirements:

Facilities:   100-240 VAC, 50/60 Hz, 10 amps
Dims:   34” x 39” x 17” (864mm x 991mm x 432mm) @ 170 lbs

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Description

AUTOMATED INSPECTION FOR:

  • Solder & lead defects
  • Component presence and position
  • Correct part
  • Polarity
  • Through–hole parts
  • Paste

FEATURES:

  • Quick Set-up
  • Mega-pixel Color Camera
  • High Defect Coverage
  • Low False Failure Rate
  • Best Price Performance

YESTech’s advanced Thin Camera technology offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput.

Programming the B3 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The B3 utilizes a standard package library to simplify training and insure program portability across manufacturing lines. Programs created with the B3 are also compatible with YESTech’s complete line of AOI systems.

Newly available Fusion Lighting and advanced image processing technology integrates several techniques, including color, normalized correlation and rule-base algorithms, to provide complete inspection coverage with an extremely low false failure rate.

The B3 is equally effective for pre / post-reflow or even final assembly inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.


Specifications

Inspection Capabilities

  • Throughput:   4 sq. in./ sec.: > 200,000 components per hour
  • Maximum Board Size:   350mm x 250mm (14 x 10 in.)
  • Clearance:   2” (50mm) top and bottom
  • Minimum Component Size:   01005
  • Defects Detected: 
    • Component: position, missing, wrong, polarity, skew, tombstone
    • Lead: bent, lifted, bridging
    • Solder: open, insufficient, short, solder balls

Software

  • Algorithms:   Normalized correlation, OCV, OCR, barcode recognition and rule-based
  • CAD Translation Package:   CircuitCAM, Unicam, YESTech CAD Utility
  • Programming Skill Level:   Technician or operator
  • Operating System Windows:   XP
  • Off-line Software:   (Optional) - Rework, Review and Program Creation
  • SPC Software:   (Optional) - Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.

Hardware

  • Lighting:   Proprietary Fusion Lighting multiangle LED
  • Imager:   Thin Camera:   25 micron, and / or 12 micron pixel size
  • Resolution:   1280 x 1024
  • Optics:   Telecentric lens (eliminates distortion for more accurate and repeatable measurement and inspection results)

Facilities

  • Power:   100-240 VAC, 50/60 Hz, 10 amps
  • Footprint:  34” x 39” x 17” (864mm x 991mm x 432mm)
  • Weight:   70 lbs (77 kg)
  • Machine Installation:  <1 hour

Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.