Omron VT-S500 AOI

Omron VT-S500 AOI {ID: 7636}

Status: Available
DOM: 2014
Condition: Superior to inline with its age
Quantity: 1

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Product installation requirements:

Facilities: 200 to 240 VAC (single phase)
Dims: 910 (W) × 1470 (D) × 1500 (H) mm @ 500kg

Product Terms:

This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance.  Availability is subject to prior sale.


Configuration

  • New PC in 2019 upgrade
  • V-TS - Teaching Station
  • V-CA - Repair Station

Description

Equipped with Color Highlight 3D (Core Technology)

  • Automatic extraction of fillet features - The VT-S500 uses new image processing technology to automatically extract fillet features, which are quantified in numerical values and used for inspection.

Direct input of quality standards.  High-speed startup with automatic programming. (Patent Pending)

  • Automatic inspection programming is possible simply by setting inspection criteria for fillet features (length, height and width).

[High-speed/stable inspection] - Inspection time improves of 60% compared with conventional models

  • Higher-speed inspection has become possible to respond to a significant increase in productivity.

Minimize the effect of secondary reflection and shadow

  • Parameters have been optimally set to pick up gradations unperceived by Human Eye and automatically separate good from bad components.

Auto parameter calculation to counteract the variation of components

  • In order to cope with component inconsistencies, parameters can be automatically calculated - simply by registering required components.

PCB position adjustment algorithm - Automatically detects to offset position of land position according to PCB variation and warpage.

  • Inspection accuracy has been improved and it has become possible to inspect at the correct position using the new position adjustment method based on the entire screen instead of the conventional land-based adjustment.

Specifications

Image signal input unit

Imaging System

5Mpixel camera / Telecentric Lens

Imaging Method

Color Highlight, 3D solder shape reconstruction

Resolution

10μm, 15μm

Main unit

Feed method

Edge Belt Conveyor, Automatic Raid width Adjust

Line height

900 ±20 mm Adjustment from adjustable feet

PCB carrier width adjustment

Automatic

Power supply

200 to 240 VAC (single phase)

Ambient operating temperature

+10 to +35?

Ambient operating humidity

35 to 80% RH (with no condensation)

Weight

Approx. 500kg

Dimensions

910 (W) × 1470 (D) × 1500 (H) mm

Inspectable PCBs

Type

Post-reflow/Flow/Post-placement

Dimensions

Single lane: 50(W) × 50(D) to 510(W) × 610(D) mm 

Thickness

0.4 to 4.0 mm

Clearance

Above PCB: 50 mm, Below PCB: 50 mm

Inspection items

Missing components, Wrong components, Component shifting (X/Y/skewing),
Fillets (wettability length, height,width of the tip, wettability angle, length of the side),
Land exposure, Polarity shifting, Polarity lifting Solder balls, Bridging, Objects,Through hole, Polarity, Inversion

Number of inspection points

10,000 components/PCB max.


Disclaimer

Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.