DOM: Dec 2018
Condition: Like New, Unused
Transfer Direction: Either
Max PCB Width: 10"
Product installation requirements:
Facilities: 100-240 VAC, 50/60 Hz, 10 amps / 60 to 90 PSI, 2 CFM
Dims: 34.5 x 40 x 55 in. @ 1700 lbs
This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit fully functional either live or by video for your acceptance. Availability is subject to prior sale.
Nordson YESTECH’s advanced megapixel technology offers high-speed PCB inspection with exceptional defect coverage. With high resolution and telecentric optics, M1 Series inspects solder joints and verifies correct part assembly, all within a footprint less than 1 meter wide, enabling users to improve quality and increase throughput.
Programming the M1 Series is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The M1 Series utilizes a standard package library to simplify training and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an extremely low false failure rate.
Configurable for all line positions, the M1 Series is equally effective for paste, pre / post-reflow or final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
Automated Inspection for:
Model: M1 Multi-function system with top-down viewing, 3 megapixel camera
Throughput: > 3550 sq. mm second (> 5.5 sq. in / second)
Maximum Board Size: 350mm x 250mm (14 x 10 in.)
Minimum Board Size: 50mm x 50mm (2 x 2 in.)
Topside Clearance: 25mm (1 in.)
Bottomside Clearance: 50mm (2 in.)
Minimum Component Size: 01005
Defects Detected: Part: position, missing, wrong, polarity, skew tombstone, etc.
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Algorithms: Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows 7
Off-line Software: Optional - Rework, Review and Program Creation
SPC Software: Optional - Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization.
Material Handling: SMEMA, dual direction auto width conveyor, pass / fail signals, board clamping
Conveyor Length: 876mm (34.5 in.)
Conveyor Height: 950mm + /- 35mm (37.5 + /- 1.3 in.)
Lighting: Proprietary Fusion Lighting™ multiangle LED
Imager: 3 megapixel color camera / Resolution 2048 x 1536; 20 or 12.5 micron pixel size
Optics: Telecentric lens (eliminates distortion for more accurate and repeatable measurement and inspection results)
Warpage Compensation: Optional
Bottomside Barcode Reader: Optional
Power: 100-240 VAC, 50/60 Hz, 10 amps
Air input: 60 to 90 PSI (0.4 to 0.6 Mpa), 2 CFM
Footprint: 876mm x 1010mm x 1400mm (34.5 x 40 x 55 in.)
Weight: 770 kg (1700 lbs)
Machine Installation: < 1 hour
Information is provided for your convenience as our good faith estimate for this equipment. CEE does not warrant the accuracy of this information due to the nature of used equipment. Used equipment can be customized, altered, or simply worn beyond the capability to perform to original specifications. If certain details are critical for your application, we highly recommend testing the machines performance on that criteria. Please notify your CEE sales representative prior to purchase and we will propose solutions for your concerns. CEE's goal is always to minimize your risk.