ICT (In-Circuit Test) and other PCB Test technologies (Flying Proble) are used to verify an completed assembly after production. ICT and Flying Probe Testers use test probles to electrically test various points on a PCB. Often ICT and Flying Probe are used when a functional test is not a viable alternative.
SMT Rework (BGA rework) is a very common function for all assemblers. The best smt rework systems will remove a defect component, place a new component with precision, and properly reflow just that component.
ICT uses a fixture system (custom bed of nails). While ICT is the fastest test solution, the fixtures are dedicated to a specific assembly. For assemblers with many products, ICT fictures can be an expensive investment.
Flying Probe is a programmable test solution. Multiple X-Y programmable probes test a pcb without the need of a fixture. Flying probe is ideally suited for assemblers who need flexibility and can sacrifice speed.
Rework systems are often dependent on custom tooling for reworking specific components. Make sure to ask what tooling is available with the rework system. Rework systems often have marginal heating power. If you pcbs are multilayer or massive, be sure to check your application before purchase.
Some common brands for ICT and Flying Probe include:
Teradyne, Agilent (Keysight), Genrad, Takaya, SPEA, Acculogic, and Nexlogic
Some common brands for Rework include:
AirVac Engineering, SRT VJ Electronix, Sniper, ERSA, Conceptronic, Metcal, and many others.
All brands have their strengths and limitations in technology. Be sure to consult with a highly experienced Capital Equipment Exchange Sales Consultant to convey your needs. We can guide you to your best solution.
If you don't find the machine you require, please contact sales. Machines that are coming soon are not listed on our website.
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