SMT Reflow ovens accept PCBs with mounted components in wet solder paste and produce soldered PCBs using convection heating to reflow the solder paste. The key to the reflow process is accurate and repeatable reflow conditions with uniform heat and speed.
Nearly all ovens today use convection heating, but IR and UV ovens are sometimes required for curing applications. Ovens will range in length for different throughput requirements. Since the adoption of lead-free SMT, which requires higher temperatures for reflow, the most common oven sizes are 7 zones, 10 zones, and 12 zones for the highest throughput needs.
Common considerations for SMT ovens are length, cooling type (air or water), flux management, and the conveyance (edge support and/or mesh). Most used ovens are very capable of lead-free soldering and the latest component technologies. Newer ovens designed for lead-free will often have addition cooling capacity.
Some common brands for SMT convection reflow ovens include:
All brands have their strengths and limitations in technology, but some ovens are definitely easier to maintain than others. Be sure to consult with a highly experienced Capital Equipment Exchange Sales Consultant to convey your needs. We can guide you to your best solution.
If you don't find the machine you require, please contact sales. Machines that are coming soon are not listed on our website.
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CEE ID: 7651